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| KYOCERA America, Inc. (U.S.A.), Kagoshima Kokubu Plant (Japan) |
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| Kyocera's cutting-edge semiconductor package products range from substrates with high-density wiring patterns to multilayer packages with built-in embedded components. |
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Developed from ceramic and organic materials, Kyocera's semiconductor packages, substrates and mounting components play a key role in computers, automotive electronics, telecommunications networks and digital consumer products. |
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Image Sensor Components |
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Surface Mount Packages for Electronic Devices |
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LTCC Packages for RF Modules |
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Components for Fiber Optic Communication |
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Fine-Pitch Multilayer Organic Packages |
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